It may be no problem because the bonding stress between substrate and plating materials mainly depends on the surface condition and low/free residual-stressed surface of substrate (it is not a metallic bonding).

Please find the following references;

ASTM B841
http://www.techsolve.org/p2iris/metalfinish/1143-s.htm
http://p2library.nfesc.navy.mil/P2_Opportunity_Handbook/1_11.html
http://www.atotech.com/start.php3?cl_my_id=760580
http://www.freepatentsonline.com/4313802.html
http://www.finishing.com/120/46.shtml
http://www.freepatentsonline.com/4758479.html
http://www.anoplate.com/news/pastnews/fall98/anozinc.htm

Thomas J.C. Eun/Canada
1-780-713-3199
thomaseun@hanmail.net